Automotive-Grade Test Center

3PEAK Suzhou Test Center covers nearly 8000 square meters, with a strong focus on wafer and finished chip testing. It integrates a comprehensive range of testing services, including chip test solution development, wafer testing, and finished product testing. Phase I completed the Class 1,000 wafer test workshop, and the Class 10,000 finished product test workshop will be deployed with over 200 sets of complete test equipment. At full capacity, wafer testing can reach tens of thousands of wafers per month, while finished chip testing can achieve hundreds of millions of chips per month.

3PEAK Suzhou Test Center offers high-voltage, high-frequency, and high-precision testing capabilities, covering semiconductor wafer CP (Chip Probing) and finished product FT (Final Test). It is capable of supporting three-temperature CP testing for both 8-inch and 12-inch wafers, and also three-temperature FT testing for mainstream packages like SOP, DFN/QFN, or BGA/QFP, etc. The test center provides comprehensive validation under extreme conditions, meeting the stringent requirements of automotive-grade products.

Through vertical integration, 3PEAK has firmly secured supply chain security and technical barriers. This marks a crucial step in evolving from a product-focused company with distinct advantages to an IDM (Integrated Device Manufacturer) model capable of full-process control. With such a robust quality assurance foundation, 3PEAK's front-end application solutions can truly instill confidence in customers.