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Automotive Product

3PEAK has built an independent and controllable in-house virtual IDM wafer platform and established its own automotive-grade product testing factory for quality control, further developing a comprehensive ISO 17025-accredited laboratory. 3PEAK has also achieved breakthroughs in multiple core product areas such as signal chains and power management. The company has also built a comprehensive automotive chip product portfolio covering scenarios including body control, intelligent cockpits, ADAS, powertrains, and chassis systems.

3PEAK Key Product Features

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    Broad Product Portfolio
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    Qualified for Automotive Applications
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    Innovation and Cost-Effectiveness
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    Vertical Integrated Supply Chain

3PEAK Automotive Product Categories

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Released
Sample Available
Blank: This type is not required for regular applications

3PEAK Automotive Product Quality

Automotive QMS
Functional Safety
Automotive-Grade Test Center

3PEAK develops, implements, and improves the QMS in accordance with  IATF16949 and customer-specific requirements. With the commitment and support of the management, a series of quality management activities have been carried out around the quality policy to enhance customer satisfaction.

3PEAK  has passed the ISO26262 ASIL D process certification. In accordance with the requirements of ISO 26262:2018 standard requirements, 3PEAK has established a product development and management process system that fully complies with the highest level of automotive functional safety "ASIL D". This demonstrates 3PEAK's high-standard and high-quality automotive R&D capabilities. In the future, 3PEAK will always be committed to the safety and reliability of ICs, focusing on the functional safety policy of "quality-based, safety first", and regard ICs functional safety as the top priority in the field of R&D.

The company enhances supply chain stability, reduces costs, and boosts overall competitiveness through vertical integration.

The Test Center integrates a complete range of testing services, including chip test solution development, wafer testing, and finished product testing.

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